Portable Harness Crimp Cross-Section Analysis System WPM-SES
Portable Harness Crimp Cross-Section Analysis System WPM-SES Portable Harness Crimp Cross-Section Analysis System WPM-SES
  • Portable Harness Crimp Cross-Section Analysis System WPM-SES

  • Model No: WPM-SES

  • Analyze harness crimp cross-sections portably with the Portable Harness Crimp Cross-Section Analysis System WPM-SES. This portable system allows for on-site analysis of crimp cross-sections, ensuring quality and compliance. Ideal for field quality control and crimp validation. Get portable crimp cross-section analysis for on-site quality assurance!

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Detailed description

High-Speed Crimp Cross-Section Analysis System | Wire Harness Terminal Analyzer for Quality Control

Introduction:

In today's demanding wire harness manufacturing environment, ensuring terminal crimp quality is paramount. The Crimp Cross-Section Analysis System is engineered to provide rapid, accurate, and comprehensive analysis of wire harness terminal cross-sections, empowering you to maintain the highest quality standards and minimize production errors. This advanced system is a complete solution for cross-section harness crimp analysis, designed for speed and precision in quality control. From quick sample preparation to detailed measurement and analysis, our system is the ideal tool for any manufacturer seeking to optimize their wire harness production process. It’s more than just a terminal analyzer; it’s your partner in ensuring reliable and consistent crimp quality.

Key Features and Benefits:

  • Rapid Sample Preparation & Analysis: Achieve quick turnaround times with our system, completing sample preparation and analysis of a terminal cross-section in under 5 minutes. This significantly accelerates your crimp cross-section quality inspection process.

  • Ergonomic and User-Friendly Design: The ergonomic design and modular construction ensure comfortable and efficient operation. The system is designed for ease of use and speed, making it accessible to operators of all skill levels.

  • Integrated Cutting and Grinding Equipment: The system features fully integrated cutting and grinding modules, streamlining the sample preparation process and ensuring consistent, high-quality cross-sections.

  • High-Definition Microscopy for Detailed Imaging: Equipped with a high-performance microscope and a Japan-imported high-definition image acquisition system, the system delivers ultra-clear, detailed images of terminal cross-sections for precise analysis.

  • 3D Stereoscopic Imaging: Experience powerful three-dimensional observation. The system generates upright three-dimensional spatial images with exceptional stereoscopic depth, providing clear, wide, and highly detailed imaging for comprehensive crimp assessment.

  • Accurate Measurement and Analysis Software: Specialized software enables simple and accurate measurement of lengths and calculation of areas. Enhanced measurement tools, including compression ratio calculation, are certified for use in the automotive, home appliance, and IT industries.

  • Robust and Reliable Control System: Features a Japanese Mitsubishi PLC controller (SBL) for stable and dependable operation, ensuring consistent performance and reliable results.

  • German-Engineered Motors for High Performance: Utilizes high-quality, German-imported motors for both the cutting and grinding modules, providing powerful and consistent performance at 2800 rpm.

  • Precise and Durable Cutting Wheel: Includes a Germany-imported, delicate and durable cutting wheel (105mm OD, 0.5mm thickness) for clean and accurate cuts.

  • Adjustable Electrolytic Polishing: Features eclipse partial electrolysis for enhanced surface preparation, suitable for terminals up to 6 mm², with adjustable electrolysis times (5-30 seconds).

  • Versatile Magnification Options: Offers a wide range of magnification options (0.75x to 5.0x) with 0.5 stuck position shift technology for detailed observation across various terminal sizes and features.

  • Adjustable LED Illumination: Features an ultra-bright white LED light source with infinitely adjustable control, ensuring optimal lighting for clear image capture under any conditions.

  • Precise X, Y, Z-Axis Mobile Platform: Equipped with a mobile platform offering +/- 6mm three-dimensional movement and fine-tuning Z-axis adjustment (0.00-5.00 mm) for precise sample positioning and observation.

  • Comprehensive Analysis and Reporting Software: Includes Section-ms software and a Japanese industrial HD video system with a 3-megapixel camera and USB 2.0 connectivity for image capture, analysis, and file recording.

  • Wide Application Range: Suitable for a broad range of wire sizes with a module cut range of 0.13 - 6.00 mm², accommodating diverse wire harness applications.

Detailed Features and Specifications (Expanding on Key Points):

The Crimp Cross-Section Analysis System is meticulously designed for efficiency and accuracy. Its integrated cutting and grinding equipment ensures smooth and consistent cross-section preparation, crucial for reliable analysis. The system boasts a high-performance microscope coupled with a Japan-imported optical system, providing exceptional clarity and detail in captured images. The 3-megapixel Japanese industrial HD video system works seamlessly with the included Section-ms software, offering a user-friendly interface for measurement, analysis, and reporting.

The system's robust mechanics are driven by German-imported motors known for their durability and precision, ensuring consistent rotate speeds of 2800 rpm for both cutting and grinding. The Germany-imported cutting wheel, with its fine 0.5mm thickness, guarantees clean and precise cuts, while the adjustable electrolytic polishing further refines the surface for optimal viewing.

The Japanese Mitsubishi PLC controller - SBL is the brain of the system, ensuring reliable and automated control over all functions. The Japanese Panasonic servo motor driven X-axis shift allows for precise positioning under the microscope, complementing the XYZ mobile platform for comprehensive sample manipulation.

The advanced optics provide a wide observation range of 1.2-8.2 mm in the X-axis direction, enhanced by the ultra-bright white LED light source which can be infinitely adjusted to achieve perfect illumination. The system’s magnification versatility, ranging from 0.75x to 5.0x with fine adjustments, ensures detailed inspection across various terminal sizes and crimp characteristics.

Technical Specifications Table:

Inquiry Quotes
Feature Specification
System Type Crimp Cross-Section Analysis System
Control System Japanese Mitsubishi PLC (SBL)
Module Cut Range 0.13 - 6.00 mm²
Rotate Speed (Cut/Grind) 2800 rpm (German Imported Motor)
Cut Speed 2 mm/sec
Cut Wheel Specifications 105mm OD, 21.7mm ID, 0.5mm Thickness (Germany Imported)
Grind Speed 2800 rpm (German Imported Motor)
Z-Axis Fine Tuning 0.00 - 5.00 mm
Sandpaper OD 100 mm
X-Axis Shift Japanese Panasonic Servo Motor
Electrolysis Range Up to 6 mm²
Electrolysis Time 5 - 30 seconds
Microscope Eyepiece 10x
Magnification Multiples 0.75x, 1x, 1.5x, 2.0x, 2.5x, 3.0x, 3.5x, 4.0x, 4.5x, 5.0x (0.5 Stuck Position Shift)
Tooth Pitch Multiples 0.75x, 1x, 1.5x, 2.0x, 2.5x, 3.0x, 3.5x, 4.0x, 4.5x, 5.0x (0.5 Stuck Position Shift)
Observation Range (X-axis) 1.2 - 8.2 mm
Lighting Ultra-Bright White LED (Infinitely Adjustable)
XYZ Mobile Platform Range +/- 6 mm (Three-Dimensional)
Imaging System Japanese Industrial HD Video System (3-Megapixel)
Camera Interface USB 2.0
Analysis Software Section-ms
Voltage/Wattage 220VAC, 50Hz, 300W
Weight 30 kg
Inquiry Quotes
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